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PCB Typology
Double-Sided
Multilayer
HDI / Sequential build up (SBU)
Flexible and Flex-Rigid
High power / Heavy Copper
Radio frequency (RF) and Microwave
Insulated Metal Substrate (IMS)
Special
Technologies
Vias technologies
Power and heat management
Controlled Impedance
Finishes
Peelable solder mask and EMI shielding
Materials
Flex
FR4 Standard & Leadfree
High frequency
Mid TG
High TG
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High speed
Services
Design
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Quick delivery (QTA)
Prototyping
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Space & New Space
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69235A07-67EE-428E-B536-7B6537BAF61F
PCB Typology
Double-Sided
Multilayer
HDI / Sequential build up (SBU)
Flexible and Flex-Rigid
High power / Heavy Copper
Radio frequency (RF) and Microwave
Insulated Metal Substrate (IMS)
Special
Technologies
Vias technologies
Power and heat management
Controlled Impedance
Finishes
Peelable solder mask and EMI shielding
Materials
Flex
FR4 Standard & Leadfree
High frequency
Mid TG
High TG
High performance
High speed
Services
Design
Lab analysis & product certification
Quick delivery (QTA)
Prototyping
Markets
Aerospace & Defense
Space & New Space
Automotive
Industrial Automation
Medical Devices
Railway
Renewables
Quality and Standards
Case
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