Special 

This category includes PCBs manufactured from mixed materials, embedded PCBs, large-size PCBs, and extra-thick printed circuit boards.

In order to achieve specific performance levels, which are indispensable in some applications, different materials are used, each one capable of giving certain specifications to the finished PCB.

The processing of different materials results in critical issues due to the different mechanical responses that each material exhibits to the stresses which it is subjected to during the production process.

Two different materials may have opposite behaviour as the temperature increases during the pressing process: one could stretch in one direction while the other shortens, one could reach the vitreous transition before the other.

These differences in behaviour can lead to misalignment between the layers of the PCB and result in poor coupling between them.

In the construction of printed circuit boards with mixed materials, the typically used material (FR4) is processed in combination with materials such as ceramic dielectric, Teflon or Kapton, depending on the requirements.

• to solder some components to the pads of a layer inside the PCB and to include it in the subsequent pressing cycle;
• to stick the electronic component to an insulating layer of the PCB and connect it electrically using laser holes after the subsequent pressing cycle.

While on the one hand these technologies meet space-saving needs and allow maximum integration, on the other they limit repairability, with a cost-benefit factor that should be carefully assessed.

We also offer large-size and extra-thick PCBs.

Significant dimensions are often required for back-panels and large-assembly PCBs where the PCB is similar in size to the same application in which it is housed.

Extra-thick printed circuit boards are frequently used in high-power applications where extra-thick copper laminates or bus bars are used.