Flex Flexible Laminates-Polyimide film based DuPont PYRALUX LF DuPont PYRALUX FR Flexible Laminates- Polyimide film based Adhesiveless DuPont PYRALUX AP DuPont PYRALUX AP-Plus DuPont PYRALUX TK Flexible Laminates- Polyimide based Adhesiveless UBE Upilex 25 µm UBE Upilex 50 µm UBE Upilex 75 µm Iteq 25 µm Iteq 50 µm Iteq 75 µm Iteq 100 µm Panasonic 25 µm Panasonic 50 µm Panasonic 75 µm Panasonic 100 µm Panasonic 125 µm Panasonic 150 µm Thin Flex 25 µm Thin Flex 50 µm Thin Flex 75 µm Thin Flex 100 µm Thin Flex 125 µm Thin Flex 150 µm Emi shielding layer Tatsuta SF-PC 6000 Tatsuta SF-PC 3301 Contact us for more information You must have JavaScript enabled to use this form. How did you know us ChooseGoogle searchLinkedInOnline portalFairs and EventsWord of mouthMagazineOther I agree to process personal data after reading the information on data processing. I agree to receive commercial and advertising information for marketing purposes. Download PCB Division - Finmasi Group Download now ISO 14001:2015 Download now IATF 16949:2016 Download now AS 9100D / EN 9100:2018 Download now EN ISO 13485:2016 Download now CASE Multilayer 16 layers with 6 flex layers Markets: Military Dynamic pointing system PCB Typology: Flexible and Flex-Rigid Technologies: 16 layers 6 flex layers Electrolytic Nickel on cavities Cavities Wire bondable pads ENIG Electrolytic hard Gold Green Solder Mask Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Multilayer 10 layers HDI Markets: infotainment Smartwatch PCB Typology: Flexible and Flex-Rigid Technologies: 10 layers HDI SBU Laser vias Stacked vias Buried vias ENIG EMI Shielding Matt Solder Mask Green Solder Mask Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Tatsuta Multilayer 6 layers HDI 2+2+2 with laser via Markets: Industrial Automation PCB Typology: Flexible and Flex-Rigid Technologies: 6 flex layers HDI SBU 2+2+2 Asymmetrical build up Laser vias Copper filling Staggered vias Buried vias Green Solder Mask Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Adhesiveless polyimide film Multilayer 9 layers 855 mm Markets: Military Radar Ground radar Sea radar PCB Typology: Flexible and Flex-Rigid Technologies: 9 layers 2 flex layers 500 micron Copper busbar HDI Controlled impedance Laser vias Buried vias 855 mm length ENIG Green Solder Mask Materials: FR4 High Tg Adhesiveless polyimide film Multilayer 12 layers HDI 2+8+2 with laser via Markets: Military Wearable device PCB Typology: Flexible and Flex-Rigid Technologies: 12 layers HDI SBU 2+8+2 Laser vias Copper filling Stacked vias Staggered vias Buried vias ENIG Green Solder Mask Materials: High performance Polyimide Resin Ventec VT901 (also No/Low flow) Adhesiveless polyimide film ECCOBOND
Multilayer 16 layers with 6 flex layers Markets: Military Dynamic pointing system PCB Typology: Flexible and Flex-Rigid Technologies: 16 layers 6 flex layers Electrolytic Nickel on cavities Cavities Wire bondable pads ENIG Electrolytic hard Gold Green Solder Mask Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film
Multilayer 10 layers HDI Markets: infotainment Smartwatch PCB Typology: Flexible and Flex-Rigid Technologies: 10 layers HDI SBU Laser vias Stacked vias Buried vias ENIG EMI Shielding Matt Solder Mask Green Solder Mask Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Tatsuta
Multilayer 6 layers HDI 2+2+2 with laser via Markets: Industrial Automation PCB Typology: Flexible and Flex-Rigid Technologies: 6 flex layers HDI SBU 2+2+2 Asymmetrical build up Laser vias Copper filling Staggered vias Buried vias Green Solder Mask Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Adhesiveless polyimide film
Multilayer 9 layers 855 mm Markets: Military Radar Ground radar Sea radar PCB Typology: Flexible and Flex-Rigid Technologies: 9 layers 2 flex layers 500 micron Copper busbar HDI Controlled impedance Laser vias Buried vias 855 mm length ENIG Green Solder Mask Materials: FR4 High Tg Adhesiveless polyimide film
Multilayer 12 layers HDI 2+8+2 with laser via Markets: Military Wearable device PCB Typology: Flexible and Flex-Rigid Technologies: 12 layers HDI SBU 2+8+2 Laser vias Copper filling Stacked vias Staggered vias Buried vias ENIG Green Solder Mask Materials: High performance Polyimide Resin Ventec VT901 (also No/Low flow) Adhesiveless polyimide film ECCOBOND
