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CASE

Multilayer SBU 3+N+3 Cu filled Multilayer SBU 3+N+3 Cu filled

Multilayer SBU 3+N+3 Cu filled

  • Markets: infotainment Video wall
  • PCB Typology: HDI / Sequential build up (SBU) HDI SBU
  • Technologies: Laser vias Copper filling  Stacked vias Buried vias Filled & capped vias ENEPIG 8 layers 3+N+3 Black Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
Multilayer 10 layer HDI Multilayer 10 layer HDI Multilayer 10 layer HDI

Multilayer 10 layers HDI

  • Markets: infotainment Smartwatch
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 10 layers HDI SBU Laser vias Stacked vias Buried vias ENIG EMI Shielding Matt Solder Mask Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Tatsuta
Multilayer 16layer with 6 flex layer Multilayer 16layer with 6 flex layer

Multilayer 16 layers with 6 flex layers

  • Markets: Military Dynamic pointing system
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 16 layers 6 flex layers Electrolytic Nickel on cavities Cavities Wire bondable pads ENIG Electrolytic hard Gold Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film
Multilayer 6 Layer HDI 2+2+2 with laser via Multilayer 6 Layer HDI 2+2+2 with laser via Multilayer 6 Layer HDI 2+2+2 with laser via

Multilayer 6 layers HDI 2+2+2 with laser via

  • Markets: Industrial Automation
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 6 flex layers HDI SBU 2+2+2 Asymmetrical build up Laser vias Copper filling  Staggered vias Buried vias Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Adhesiveless polyimide film
Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm

Multilayer 9 layers 855 mm

  • Markets: Military Radar Ground radar Sea radar
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 9 layers 2 flex layers 500 micron Copper busbar HDI Controlled impedance Laser vias Buried vias 855 mm length ENIG Green Solder Mask
  • Materials: FR4 High Tg Adhesiveless polyimide film
24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness

24 layers, 640 mm long x 4.20 mm thickness

  • Markets: Military Avionic radar
  • PCB Typology: Multilayer
  • Solutions: Power management
  • Technologies: 24 layers Mixed Copper thickness Laser vias Filled & capped vias 640 mm lenght 4.20 mm thickness ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata

Multilayer 8 layers with embeded copper coin

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 8 layers Embedded Copper coins Back Drilling Filled & capped vias Mixed materials ENIG Electrolytic soft Gold Blue Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)
Multilayer 8 layer mixed layup Multilayer 8 layer mixed layup Multilayer 8 layer mixed layup Multilayer 8 layer mixed layup

Multilayer 8 layers mixed layup

  • Markets: Telecom
  • PCB Typology: Multilayer
  • Technologies: 8 layers Mixed materials Filled & capped vias Back Drilling ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)
Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch

Ml8–Logic + power on same PCB with fine pitch

  • Markets: Automotive hybrid car
  • PCB Typology: Multilayer
  • Solutions: Logic & power PCB
  • Technologies: 18 layers Mixed Copper thickness Fine pitch ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
Multistrato rigido, 14 strati con materiali misti Multistrato rigido, 14 strati con materiali misti

Multilayer 14 layers mixed layup

  • Markets: Military Radar
  • PCB Typology: Multilayer
  • Technologies: Cavities ENIG Bondable Gold 14 layers Mixed materials Green Solder Mask
  • Materials: FR4 High Tg High Frequency Rogers® RO3035 Taconic® RF35A2
Multilayer 6 layer laser via and UBGA Multilayer 6 layer laser via and UBGA Multilayer 6 layer laser via and UBGA

Multilayer 6 layers laser via and UBGA

  • Markets: Medical
  • PCB Typology: Multilayer
  • Technologies: 6 layers Micro BGA Laser vias Filled & capped vias ENIG Blue Solder Mask
  • Materials: FR4 High Tg Nelco N4000-29