High performance

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CASE

Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via

Multilayer 12 layers HDI 2+8+2 with laser via

  • Markets: Military Wearable device
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 12 layers HDI SBU 2+8+2 Laser vias Copper filling  Stacked vias Staggered vias Buried vias ENIG Green Solder Mask
  • Materials: High performance Polyimide Resin Ventec VT901 (also No/Low flow) Adhesiveless polyimide film ECCOBOND
SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias

SBU with 5+N+5 with Cu filled vias

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 24 layers SBU 5+N+5 Resin filling Electrolytic Nickel on cavities ENIG Green Solder Mask
  • Materials: Polyimide Copper/Invar/Copper
  • Certificates: Integrated Management System Policy
Multilayer 6 Layer HDI 2+2+2 with laser via Multilayer 6 Layer HDI 2+2+2 with laser via Multilayer 6 Layer HDI 2+2+2 with laser via

Multilayer 6 layers HDI 2+2+2 with laser via

  • Markets: Industrial Automation
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 6 flex layers HDI SBU 2+2+2 Asymmetrical build up Laser vias Copper filling  Staggered vias Buried vias Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Adhesiveless polyimide film
Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm

Multilayer 9 layers 855 mm

  • Markets: Military Radar Ground radar Sea radar
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 9 layers 2 flex layers 500 micron Copper busbar HDI Controlled impedance Laser vias Buried vias 855 mm length ENIG Green Solder Mask
  • Materials: FR4 High Tg Adhesiveless polyimide film
Multilayer 16layer with 6 flex layer Multilayer 16layer with 6 flex layer

Multilayer 16 layers with 6 flex layers

  • Markets: Military Dynamic pointing system
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 16 layers 6 flex layers Electrolytic Nickel on cavities Cavities Wire bondable pads ENIG Electrolytic hard Gold Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film
Multilayer 10 layer HDI Multilayer 10 layer HDI Multilayer 10 layer HDI

Multilayer 10 layers HDI

  • Markets: infotainment Smartwatch
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 10 layers HDI SBU Laser vias Stacked vias Buried vias ENIG EMI Shielding Matt Solder Mask Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Tatsuta

NEWS AND EVENTS

Bologna  - 

Fiere ed Eventi

Fortronic 2022

Cistelaier S.p.A. parteciperà per il secondo anno consecutivo a Fortronic, da oltre 20 anni l’unico evento per l’ELETTRONICA di potenza e non solo, in contemporanea con E-TECH Europe, fiera e conferenza sulle tecnologie elettriche ed elettroniche per l'industria dei veicoli elettrici.

Ci troverete all’interno del padiglione 19 dedicato all’evento, allo stand A37, di fronte all’Agorà.

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Bologna  - 

Fiere ed Eventi

Finmasi Group PCB Division parteciperà a Power Fortronic

Finmasi Group PCB Division prenderà parte alla prossima edizione di Power Fortronic. Vi aspettiamo allo stand A35 del Padiglione nr. 1 di PiacenzaExpo il 23 e il 24 giugno 2021. 

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