Casi d'uso AllSBUMixed MaterialsMilitaryRigid-Flex PCBsBack DrillingResin FillingStacked ViasMixed FinishesCopper FillingSpecial PCBs Multilayer SBU 3+N+3 Cu filled Markets: infotainment Video wall PCB Typology: HDI / Sequential build up (SBU) HDI SBU Technologies: Laser vias Copper filling Stacked vias Buried vias Filled & capped vias ENEPIG 8 layers 3+N+3 Black Solder Mask Materials: FR4 High Tg Iteq IT180A Multilayer 14 layers mixed layup Markets: Military Radar PCB Typology: Multilayer Technologies: Cavities ENIG Bondable Gold 14 layers Mixed materials Green Solder Mask Materials: FR4 High Tg High Frequency Rogers® RO3035 Taconic® RF35A2 Multilayer 10 layers SBU 3+N+3 Laser vias Markets: Renewables PCB Typology: HDI / Sequential build up (SBU) HDI SBU Technologies: Laser vias Staggered vias ENIG 10 layers 3+N+3 Green Solder Mask Materials: Low DK & DF High Speed Isola Fr408HR Multilayer 8 layers mixed layup Markets: Telecom PCB Typology: Multilayer Technologies: 8 layers Mixed materials Filled & capped vias Back Drilling ENIG Green Solder Mask Materials: FR4 High Tg Iteq IT180A High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable) Multilayer 6 layers laser via and UBGA Markets: Medical PCB Typology: Multilayer Technologies: 6 layers Micro BGA Laser vias Filled & capped vias ENIG Blue Solder Mask Materials: FR4 High Tg Nelco N4000-29 Multilayer 12 layers HDI 2+8+2 with laser via Markets: Military Wearable device PCB Typology: Flexible and Flex-Rigid Technologies: 12 layers HDI SBU 2+8+2 Laser vias Copper filling Stacked vias Staggered vias Buried vias ENIG Green Solder Mask Materials: High performance Polyimide Resin Ventec VT901 (also No/Low flow) Adhesiveless polyimide film ECCOBOND Pagination Previous page Current page 1 Page 2 Page 3 Next page
Multilayer SBU 3+N+3 Cu filled Markets: infotainment Video wall PCB Typology: HDI / Sequential build up (SBU) HDI SBU Technologies: Laser vias Copper filling Stacked vias Buried vias Filled & capped vias ENEPIG 8 layers 3+N+3 Black Solder Mask Materials: FR4 High Tg Iteq IT180A
Multilayer 14 layers mixed layup Markets: Military Radar PCB Typology: Multilayer Technologies: Cavities ENIG Bondable Gold 14 layers Mixed materials Green Solder Mask Materials: FR4 High Tg High Frequency Rogers® RO3035 Taconic® RF35A2
Multilayer 10 layers SBU 3+N+3 Laser vias Markets: Renewables PCB Typology: HDI / Sequential build up (SBU) HDI SBU Technologies: Laser vias Staggered vias ENIG 10 layers 3+N+3 Green Solder Mask Materials: Low DK & DF High Speed Isola Fr408HR
Multilayer 8 layers mixed layup Markets: Telecom PCB Typology: Multilayer Technologies: 8 layers Mixed materials Filled & capped vias Back Drilling ENIG Green Solder Mask Materials: FR4 High Tg Iteq IT180A High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)
Multilayer 6 layers laser via and UBGA Markets: Medical PCB Typology: Multilayer Technologies: 6 layers Micro BGA Laser vias Filled & capped vias ENIG Blue Solder Mask Materials: FR4 High Tg Nelco N4000-29
Multilayer 12 layers HDI 2+8+2 with laser via Markets: Military Wearable device PCB Typology: Flexible and Flex-Rigid Technologies: 12 layers HDI SBU 2+8+2 Laser vias Copper filling Stacked vias Staggered vias Buried vias ENIG Green Solder Mask Materials: High performance Polyimide Resin Ventec VT901 (also No/Low flow) Adhesiveless polyimide film ECCOBOND
